Cupertino, July 8, 2026

Apple and the chipmaker Broadcom have signed a new contract for the production of more than 15 billion chips in the USA, announcing the largest single commitment to date under Apple's "American Manufacturing Program."

The agreement provides for Broadcom to produce high-frequency components such as FBAR filters and wireless connectivity solutions at facilities in the United States over the coming years. „Dabei werde es sich um Technik rund um die Anbindung zu Kommunikationsnetzen handeln, so der iPhone-Konzern." The total investment volume is put at approximately 30 billion US dollars by both companies.

According to Broadcom, 1.5 billion US dollars of this is earmarked for the expansion and modernization of the plant in Fort Collins, Colorado. High-frequency components such as FBAR filters and wireless connectivity solutions are to be manufactured there in the future. A specific date for the commissioning of the new capacities has not yet been given. „Ein Zeitpunkt für die Inbetriebnahme der neuen Kapazitäten wurde nicht genannt."